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Holistic Lithography

Holistic Lithography

The move to the 32-nm node and beyond presents unique challenges for the semiconductor industry. Ultra-low k1 production techniques mean it will no longer be enough to consider IC design, mask creation, lithography and metrology in isolation. Instead we will need a new integrated approach to IC manufacture. The ability to optimize multiple IC production steps simultaneously is fundamental to ASML's Holistic Lithography vision. Read More »



February 22-26
SPIE Advanced Lithography
San Jose, CA

February 22
ASML Technical Symposium at SPIE

Fall (date TBA)
ASML Regional Technology Symposium